Product
MT350 Series Wafer Laser Resistor Trimming Machine | High Precision for Wafer-Level Devices
Equipment Features
▪ Proprietary software with user-friendly interface and easy operation.
▪ Equipped with a wafer preview function.
▪ Supports the import and export of processing plans, facilitating the handling of different product models.
▪ Provides processing data recording to meet quality control and data analysis needs.
▪ Flexible and easy-to-use custom programming features for personalized adjustments, with options for saving, retrieving, and modifying, significantly enhancing mass production efficiency.
▪ The software supports visual recognition, XY alignment, angle detection, and automatic platform focus adjustment.
▪ Supports distance and angle measurement functions.
▪ Enables remote functionality, compatible with MES systems or other equipment for integration.
▪ Equipped with coaxial vision alignment for improved processing precision and operational convenience.
▪ Features off-axis vision with support for motorized zoom adjustment.
▪ Integrated automatic loading and unloading mechanism for automated production.
Specifications
| Laser Wavelength | 355 nm |
| Minimum Spot Size | 5 μm |
| Galvanometer Scanning Speed | 0-8000 mm/s |
| Galvanometer Repeatability | ±1 μm |
| Motion | mechanism |
| XY module repeat positioning accuracy | <±1μm |
| Rotary table repeat positioning accuracy | ±2.5″ |
| Lifting platform repeat positioning accuracy | <±1μm |
Wafer-specific automatic loading and unloading mechanism
Measurement system
| Resistance adjustment range | 10Ω–1MΩ |
| Resistance adjustment accuracy | <±0.3% |
| Standard configuration | 24 measurement channels |
Power requirements
| Equipment power supply | 220V, 50Hz (single-phase) |
| Air supply pressure | 0.4–0.6 Mpa |
| Ambient temperature | 24±4°C; air-conditioned constant temperature |
Product Pictures
FAQs +
What are the precautions for the operation of the Wafer Laser Resistor Trimmer?
Equipment Maintenance:
▪ Clean the optical components regularly to avoid dust affecting the laser focusing.
▪ Regularly check the positioning accuracy of the table to ensure repeatable positioning accuracy.
▪ Keep the equipment operating environment clean and stable, avoid static electricity and leakage .
Operation safety:
▪ The laser belongs to Class 4 laser, wear protective glasses when operating.
▪ Ensure that the equipment is well grounded to prevent electrical leakage.
Process Optimization:
▪ Adjust the laser parameters according to the resistive material and substrate type to optimize the trimming effect.
▪ Monitor resistance changes in real time during the trimming process to ensure accuracy.